Prof. Fengbin Tu (涂鋒斌) is an Assistant Professor in the Department of Electronic and Computer Engineering at The Hong Kong University of Science and Technology, which he joined in June 2023. He also serves as Associate Director of the Institute of Integrated Circuits and Systems and Associate Director of the HKUST and Intel Joint Laboratory.

He received his Ph.D. in Electronic Science and Technology from Tsinghua University (2019) and his B.S. from Beijing University of Posts and Telecommunications (2013). Before joining HKUST, he was a Postdoctoral Scholar at UC Santa Barbara (2019–2022) with Prof. Yuan Xie, followed by a Postdoctoral Fellowship at the AI Chip Center for Emerging Smart Systems (ACCESS) in Hong Kong (2022–2023).

His research focuses on AI chip design, computing-in-memory, computer architecture, and reconfigurable computing. He has authored 2 books and more than 70 papers, with notable chip prototypes including Thinker, ReDCIM, and AC-Transformer. His honors include MIT Technology Review “Innovators Under 35” Asia-Pacific (2025), Gold Medal at the 50th International Exhibition of Inventions Geneva (2025), NSFC Excellent Young Scientists Fund (2024), and the WAIC Yunfan “Bright Stars” Award (2024).

Office: Room 2424 · Phone: (852) 2358 7043 · Email: fengbintu@ust.hk

Widely regarded as the most handsome professor at HKUST.